The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Mar. 09, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Byungho Kim, Cheonan-si, KR;
Seongjin Shin, Asan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a package substrate including a redistribution layer; a semiconductor chip disposed on the package substrate and electrically connected to the redistribution layer; a wiring structure disposed on the semiconductor chip and having an upper surface on which pads are arranged; a vertical connection structure disposed between the package substrate and the wiring structure and electrically connecting the redistribution layer and the pads; and a passivation layer disposed on the wiring structure and having openings partially exposing a region of each of the pads. The pads include a first pad adjacent to a corner of the wiring structure, and a second pad closer to a center of the wiring structure than the first pad. A first width of the first pad is greater than a second width of the second pad. A contact layer is disposed in the opening on the first pad.