Byung Chun Lee

Title: Byung Chun Lee: Innovator in Curing Technologies

Introduction

Byung Chun Lee is a prominent inventor based in Beijing, China. He has made significant contributions to the field of curing technologies, holding a total of 5 patents. His innovative approaches have led to advancements in methods and apparatuses that enhance production processes.

Latest Patents

Among his latest patents is a "Curing Apparatus and Curing Method." This invention features a chamber designed to accommodate a substrate with a polyimide adhesive. It includes an air extracting unit for evacuating the chamber and a heating unit that performs a two-step heating process to remove organic gases and cure the adhesive effectively. Another notable patent is the "Method for Preparing Film Patterns." This method simplifies the production of film patterns by utilizing a complementary film pattern and an erasable agent, ultimately reducing production costs.

Career Highlights

Byung Chun Lee has worked with notable companies such as BOE Technology Group Co., Ltd. and Chengdu BOE Optoelectronics Technology Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas in curing technologies.

Collaborations

Throughout his career, Lee has collaborated with talented individuals, including Yuqing Yang and Seung Yik Park. These partnerships have contributed to the successful development of his inventions.

Conclusion

Byung Chun Lee's work in curing technologies showcases his innovative spirit and dedication to improving production processes. His patents reflect a commitment to advancing the field and providing practical solutions for industry challenges.