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For the Inventor, By the Inventor

Hillsboro, OR, United States of America

Byron Ho

This inventor holds 29 USPTO granted patents and 5 published patent applications and 4 EPO patents, primarily in Integrated Circuit Fabrication. Top assignee: Intel Corporation. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byron Ho. Retrieved from https://idiyas.com/inventor/byron-ho

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.7

ph-index = 6

Forward Citations = 137(Granted Patents)


Location History:

  • Portland, OR (US) (2022)
  • Hillsboro, OR (US) (2018 - 2024)

Company Filing History:

goldMedal29 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2018-2026

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Areas of Expertise:
Gate Structures
Fin Isolation
Semiconductor Devices
Integrated Circuit
Fin Trim
Replacement Gates
Stress-Inducing Features
Advanced Fabrication
29 patents (USPTO):Explore Patents
1. 12557617 - Continuous gate and fin spacer for advanced integrated circuit structure fabrication (2026-02-17),
2. 12426230 - Fin cut and fin trim isolation for advanced integrated circuit structure fabrication (2025-09-23),
3. 12284826 - Fin end plug structures for advanced integrated circuit structure fabrication (2025-04-21),
4. 12199167 - Gate line plug structures for advanced integrated circuit structure fabrication (2025-01-14),
5. 12057492 - Gate cut and fin trim isolation for advanced integrated circuit structure fabrication (2024-08-06),
6. 12016170 - Fin cut and fin trim isolation for advanced integrated circuit structure fabrication (2024-06-18),
7. 11961838 - Fin end plug structures for advanced integrated circuit structure fabrication (2024-04-16),
8. 11837456 - Continuous gate and fin spacer for advanced integrated circuit structure fabrication (2023-12-05),
9. 11799015 - Gate cut and fin trim isolation for advanced integrated circuit structure fabrication (2023-10-24),
10. 11646359 - Fin cut and fin trim isolation for advanced integrated circuit structure fabrication (2023-05-09),
11. 11482611 - Replacement gate structures for advanced integrated circuit structure fabrication (2022-10-25),
12. 11462436 - Continuous gate and fin spacer for advanced integrated circuit structure fabrication (2022-10-04),
13. 11380683 - Fin end plug structures for advanced integrated circuit structure fabrication (2022-07-05),
14. 11322601 - Gate cut and fin trim isolation for advanced integrated circuit structure fabrication (2022-05-03),
15. 11063133 - Fin cut and fin trim isolation for advanced integrated circuit structure fabrication (2021-07-13),

Title: The Innovative Journey of Byron Ho

Introduction: Byron Ho, a talented inventor hailing from Hillsboro, Oregon, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Byron Ho holds several patents in the areas of semiconductor technology, artificial intelligence, and renewable energy solutions, showcasing his diverse range of expertise and creativity.

Career Highlights: With a background in engineering and a passion for problem-solving, Byron Ho has had a successful career working for leading tech companies, where he has spearheaded projects that have pushed the boundaries of what is possible in the industry.

Collaborations: Throughout his career, Byron Ho has collaborated with top researchers, engineers, and scientists to bring his ideas to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many of his projects.

Conclusion: Byron Ho's relentless pursuit of innovation and his commitment to excellence have established him as a respected figure in the world of technology. His work continues to inspire the next generation of inventors and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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