The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Dec. 29, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Heidi M. Meyer, Hillsboro, OR (US);

Ahmet Tura, Portland, OR (US);

Byron Ho, Hillsboro, OR (US);

Subhash Joshi, Hillsboro, OR (US);

Michael L. Hattendorf, Portland, OR (US);

Christopher P. Auth, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 29/78 (2006.01); H01L 21/8234 (2006.01); H01L 21/8238 (2006.01); H01L 21/311 (2006.01); H01L 29/08 (2006.01); H01L 27/11 (2006.01); H01L 29/66 (2006.01); H01L 21/308 (2006.01); H01L 27/092 (2006.01); H01L 29/51 (2006.01); H01L 21/28 (2006.01); H01L 21/033 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 49/02 (2006.01); H01L 21/768 (2006.01); H01L 21/285 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76224 (2013.01); H01L 21/0337 (2013.01); H01L 21/28247 (2013.01); H01L 21/28568 (2013.01); H01L 21/3086 (2013.01); H01L 21/31105 (2013.01); H01L 21/31144 (2013.01); H01L 21/76816 (2013.01); H01L 21/823431 (2013.01); H01L 21/823481 (2013.01); H01L 21/823807 (2013.01); H01L 21/823814 (2013.01); H01L 21/823821 (2013.01); H01L 21/823842 (2013.01); H01L 21/823857 (2013.01); H01L 21/823871 (2013.01); H01L 21/823878 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/53238 (2013.01); H01L 23/53266 (2013.01); H01L 27/0886 (2013.01); H01L 27/0924 (2013.01); H01L 27/1104 (2013.01); H01L 28/24 (2013.01); H01L 29/0847 (2013.01); H01L 29/516 (2013.01); H01L 29/6653 (2013.01); H01L 29/66795 (2013.01); H01L 29/66818 (2013.01); H01L 29/785 (2013.01); H01L 29/7843 (2013.01); H01L 29/7846 (2013.01); H01L 29/7848 (2013.01); H01L 29/7854 (2013.01);
Abstract

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. An insulating structure is directly adjacent sidewalls of the lower fin portion of the fin. A first gate electrode is over the upper fin portion and over a first portion of the insulating structure. A second gate electrode is over the upper fin portion and over a second portion of the insulating structure. A first dielectric spacer is along a sidewall of the first gate electrode. A second dielectric spacer is along a sidewall of the second gate electrode, the second dielectric spacer continuous with the first dielectric spacer over a third portion of the insulating structure between the first gate electrode and the second gate electrode.


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