Brian Schieck

Title: Brian Schieck: Innovator in IC Package Design

Introduction

Brian Schieck is a notable inventor based in Hayward, CA (US). He has made significant contributions to the field of integrated circuit (IC) packaging, holding a total of 8 patents. His work focuses on addressing critical challenges in IC package design, particularly concerning thermal expansion mismatches.

Latest Patents

One of Brian's latest patents is titled "IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures." This patent describes an IC package that includes an integrated circuit die with a major surface and solder bumps located in at least one corner region. The substrate has a surface with bump pads, and the major surface of the die faces the substrate surface. The solder bumps are bonded to the bump pads, forming a bond joint. The design ensures that the major surface of the die has a footprint area of at least about 400 mm, with a ratio of the coefficient of thermal expansion (CTE) of the substrate to that of the die being at least about 3:1. This innovation also includes a method for manufacturing the IC package.

Career Highlights

Brian Schieck is currently employed at Nvidia Corporation, where he continues to push the boundaries of IC packaging technology. His expertise in this area has made him a valuable asset to the company and the industry as a whole.

Collaborations

Throughout his career, Brian has collaborated with talented individuals such as Howard Lee Marks and Gurpreet Shinh. These collaborations have further enhanced his innovative capabilities and contributed to the success of his projects.

Conclusion

Brian Schieck is a prominent figure in the field of IC package design, with a focus on overcoming thermal expansion challenges. His contributions through patents and collaborations highlight his commitment to innovation in technology.