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For the Inventor, By the Inventor

Boise, ID, United States of America

Brian F Gordon

USPTO Granted Patents = 29

Average Co-Inventor Count = 2.7

ph-index = 5

Forward Citations = 657(Granted Patents)


Company Filing History:

goldMedal29 out of 37,950 
 
Micron Technology Incorporated
 patents

Years Active: 2000-2011

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29 patents (USPTO):Explore Patents
1. 8053371 - Apparatus and methods for selective removal of material from wafer alignment marks (2011-11-08),
2. 7244681 - Methods for selective removal of material from wafer alignment marks (2007-07-17),
3. 7093704 - Printed circuit board support (2006-08-22),
4. 6971499 - Printed circuit board support (2005-12-06),
5. 6962248 - Printed circuit board support (2005-11-08),
6. 6898838 - Inflatable bladder with suction for supporting circuit board assembly processing (2005-05-31),
7. 6889698 - Apparatus for selective removal of material from wafer alignment marks (2005-05-10),
8. 6863170 - Printed circuit board support (2005-03-08),
9. 6863169 - Printed circuit board support (2005-03-08),
10. 6857627 - Inflatable bladder with suction for supporting circuit board assembly processing (2005-02-22),
11. 6749054 - Printed circuit board support (2004-06-15),
12. 6693034 - Deadhesion method and mechanism for wafer processing (2004-02-17),
13. 6656402 - Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processing (2003-12-02),
14. 6645345 - Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing (2003-11-11),
15. 6631798 - Printed circuit board support (2003-10-14),

Title: Brian F. Gordon: Innovator in Wafer Processing Technologies

Introduction

Brian F. Gordon, based in Boise, ID, is a notable inventor with a remarkable portfolio of 29 patents. His work primarily focuses on innovations related to semiconductor manufacturing, specifically in the domain of wafer processing technologies. With extensive experience, Gordon has significantly contributed to the advancement of integrated circuit fabrication processes.

Latest Patents

Among his latest inventions are two similar patents titled "Apparatus and methods for selective removal of material from wafer alignment marks" and "Methods for selective removal of material from wafer alignment marks." These patents detail a process and apparatus for the selective removal of materials, particularly refractory metals like tungsten, from designated areas of silicon wafers during the intricate process of creating integrated circuits.

Career Highlights

Brian F. Gordon's career is marked by his tenure at Micron Technology Incorporated, a leading company in the semiconductor industry. His innovative spirit and technical expertise have led to vital advancements within the field, streamlining wafer processing techniques that enhance the efficiency and precision of integrated circuit production.

Collaborations

Throughout his career, Gordon has collaborated with esteemed colleagues, including Hugh E. Stroupe and Guy T. Blalock. These partnerships have fostered an environment of innovation, where collaborative efforts have led to the development of groundbreaking technologies in the semiconductor space.

Conclusion

In conclusion, Brian F. Gordon stands out as a pivotal figure in the realm of semiconductor innovations. His extensive patent portfolio reflects his dedication to advancing wafer processing technologies, contributing to the ongoing evolution of integrated circuit fabrication. With his work at Micron Technology Incorporated and fruitful collaborations, Gordon continues to play an essential role in shaping the future of the semiconductor industry.

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