Micron Technology Incorporated

Brian F Gordon

Hugh E Stroupe

Guy T Blalock

Guy F Hudson

Todd A Dobson

Tony M Teitenberg

John S Godfrey

Russell C Zahorik

Paul D Shirley

Renee Zahorik, Legal Representative

Russell C Zahorik, Deceased

Hugh F Stroupe

A process and apparatus for locally removing any material, such as a refractory metal, in particular tungsten, from any desired area of a wafer, such as an alignment mark area of a silicon wafer in process during the formation of integrated circuits thereon.

Apparatus and methods for selective removal of material from wafer alignment marks

Methods for selective removal of material from wafer alignment marks

A printed circuit board conveying system is provided comprising a printed circuit board conveyor and a printed circuit board support. The printed circuit board support is positioned to support a major portion of the printed circuit board between opposite lateral edge portions of the board and comprises a support base, a spacer, and a spacer securement. A printed circuit board processing system including the conveying system is also provided. The conveying system couples a printed circuit board loader to a stencil printer, a pick and place machine, and a reflow oven.

Printed circuit board support

A printed circuit board conveying and processing system. In accordance with the present invention, a printed circuit board conveying system is provided comprising a pair of conveyor rails and a printed circuit board support. The conveyor rails are positioned to engage opposite lateral edge portions of a printed circuit board along a conveyor path. The printed circuit board support is positioned to support a major portion of the printed circuit board between the lateral edge portions. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR &#xa7;1.72(b).

An inflatable bladder comprising at least one aperture and/or at least one baffle within the bladder for supporting a printed circuit board during component placement on a semiconductor substrate such as a printed circuit board is provided. The inflatable bladder is positioned to provide support for the substrate while apertures within the inflatable bladder communicate a suction force to the substrate to inhibit the substrate from bending, bowing, or flexing away from contact with the inflatable bladder during component placement. The inflatable bladder provides support for the substrate while attempting to prevent injury to components by pliably conforming to component irregularities on the back side of the substrate. The inflatable bladder can be selectively inflated or deflated for contacting the substrate and thereafter supporting the back side of the substrate during assembly operations. Alternatively, a lift table can be selectively raised or lowered for placing the inflatable bladder in contact with the back side of the substrate during assembly operations. The inflatable bladder can contain one or more baffles to define one or more compartments within the inflatable bladder. The inflatable bladder can be incorporated into a typical system for component assembly comprising a pair of rails, each having a slot therein, for receiving a substrate.

Inflatable bladder with suction for supporting circuit board assembly processing

Apparatus for selective removal of material from wafer alignment marks

A printed circuit board support comprising a support base and a base extension assembly. The support base defines a support surface. The base extension assembly is secured to the support base and is arranged to define a variable extension assembly height dimension and at least a portion of a height dimension of the printed circuit board support, wherein variation of the variable extension assembly height dimension results in variation of the height dimension of the printed circuit board support. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR &#xa7;1.72(b).

A method of conveying a printed circuit board in a printed circuit board conveying system. The conveying system comprises a pair of conveyor rails and a printed circuit board support assembly. The rails are positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey the printed circuit board along a conveyor path. The support assembly is positioned to support a major portion of the printed circuit board between the lateral edge portions and comprises a support base and a spacer selected from a plurality of spacers. The method comprises selecting a spacer as a function of its thickness and a thickness profile of the printed circuit board engaged by the pair of conveyor rails, installing the selected spacer by extending at least one projection into a recess, and engaging an upper spacer surface of the selected spacer with the printed circuit board. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR &#xa7;1.72().

A printed circuit board support comprising a support base, a base extension and a magnetic source. The support base defines a support surface and a lower surface. The base extension is secured to the support base and arranged to define at least a portion of a height dimension of the printed circuit board support. The magnetic source is secured to the base extension and positioned such that the lower surface of the support base is arranged to secure the printed circuit board support to an object under magnetic force. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR &sect;1.72 ( ).

A method of manufacturing semiconductor devices using an improved planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed flexible planar interface material contacting the deformable material.

Deadhesion method and mechanism for wafer processing

In connection with wafer planarization, an apparatus for forming a layer of material having a substantially uniform thickness and substantially parallel first and second major surfaces includes a pair of pressing elements and a stop. Each of the pair of pressing elements has a flat pressing surface. The pressing surfaces are opposed to one another and operable to compress a quantity of the material therebetween. The stop is positioned at least partially between the pressing surfaces and has a thickness substantially equal to the desired uniform thickness of the layer. The stop is positioned to establish a spacing between the flat pressing surfaces that is substantially equal to the thickness of the stop and thereby to the desired uniform thickness of the layer when the pressing elements engage the stop. As a result, engagement of the stop by the pressing surfaces during pressing of the material forms a layer of the material of substantially uniform thickness with substantially parallel major surfaces formed by the flat pressing surfaces. The layer is then used in semiconductor processing to provide a flat surface on a layer of a substrate assembly, thereby enhancing the planarization of the substrate assembly.

Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processing

Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing

A printed circuit board support, conveying system, and processing system. In accordance with the present invention, a printed circuit board support is provided comprising a support base, a spacer, and a spacer securement. The support base defines a support surface. The spacer engages the support surface. The spacer securement includes a projection and a recess. The projection adjoins one of the support base and the spacer. The recess is formed in the other of the support base and the spacer. The projection extends into the recess and the projection and the recess are configured such that the extension of the projection into the recess limits movement of the spacer relative to a plane parallel to the support surface.

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Boise, ID, United States of America

Brian F Gordon