The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Aug. 25, 2003
Applicants:
Renee Zahorik, Legal Representative, Boise, ID (US);
Guy F. Hudson, Boise, ID (US);
Hugh E. Stroupe, Boise, ID (US);
Todd A. Dobson, Meridian, ID (US);
Brian F. Gordon, Boise, ID (US);
Inventors:
Renee Zahorik, legal representative, Boise, ID (US);
Guy F. Hudson, Boise, ID (US);
Hugh E. Stroupe, Boise, ID (US);
Todd A. Dobson, Meridian, ID (US);
Brian F. Gordon, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract
A process and apparatus for locally removing any material, such as a refractory metal, in particular tungsten, from any desired area of a wafer, such as an alignment mark area of a silicon wafer in process during the formation of integrated circuits thereon.