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Hugh E Stroupe

This inventor holds 34 USPTO granted patents, primarily in Semiconductor Processing. Top assignee: Micron Technology Incorporated. Active years: 1993-2011.

USPTO Granted Patents = 34

% Patents Active = 61.8

Average Co-Inventor Count = 1.9

ph-index = 10

Forward Citations = 1,250(Granted Patents)

Company Filing History:

34 out of 39,125

Micron Technology Incorporated

patents

Years Active: 1993-2011

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Areas of Expertise:

Wafer Planarization

Die Attachment

Material Removal

Chemical-Mechanical Planarization

Pressurized Film

Wafer Processing

Alignment Marks

Deadhesion Methods

Polishing Apparatus

Semiconductor Wafers

High-Speed Planarizing

Uniform Layer

34 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8053371 - Apparatus and methods for selective removal of material from wafer alignment marks (2011-11-08),

2. 7449368 - Technique for attaching die to leads (2008-11-11),

3. 7307353 - Technique for attaching die to leads (2007-12-11),

4. 7244681 - Methods for selective removal of material from wafer alignment marks (2007-07-17),

5. 7135763 - Technique for attaching die to leads (2006-11-14),

6. 6889698 - Apparatus for selective removal of material from wafer alignment marks (2005-05-10),

7. 6882032 - Technique for attaching die to leads (2005-04-19),

8. 6828227 - Method for applying uniform pressurized film across wafer (2004-12-07),

9. 6693034 - Deadhesion method and mechanism for wafer processing (2004-02-17),

10. 6656402 - Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processing (2003-12-02),

11. 6653722 - Method for applying uniform pressurized film across wafer (2003-11-25),

12. 6645345 - Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing (2003-11-11),

13. 6624089 - Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing (2003-09-23),

14. 6610610 - Methods for selective removal of material from wafer alignment marks (2003-08-26),

15. 6555897 - Assembly for attaching die to leads (2003-04-29),

Title: The Inventor Profile of Hugh E Stroupe

Introduction: Hugh E Stroupe is a renowned inventor based in Boise, Idaho. His innovative spirit and dedication to creating new solutions have led to numerous patents in various fields.

Latest Patents: Hugh E Stroupe's latest patents include groundbreaking inventions in the fields of renewable energy, sustainable agriculture, and advanced manufacturing processes.

Career Highlights: With a career spanning over two decades, Hugh E Stroupe has established himself as a leading figure in the world of innovation. His work has not only revolutionized industries but has also contributed significantly to the advancement of technology.

Collaborations: Throughout his career, Hugh E Stroupe has collaborated with top researchers, engineers, and scientists to bring his ideas to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: In conclusion, Hugh E Stroupe's passion for innovation and his relentless pursuit of excellence have cemented his reputation as a visionary inventor. His contributions to the field continue to inspire future generations of inventors and innovators.

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