Bong-Gyun Ko

Title: Innovations of Bong-Gyun Ko in Semiconductor Technology

Introduction

Bong-Gyun Ko is a prominent inventor based in Tokyo, Japan, known for his significant contributions to semiconductor technology. With a total of eight patents to his name, he has made remarkable advancements in the field, particularly concerning silicon wafers.

Latest Patents

Among his latest patents is a method of reducing warp imparted to silicon wafers with specific orientations. This method utilizes anisotropic film stress of a multilayer film to minimize warp in silicon wafers that have a (110) plane orientation and a <111> notch orientation. Additionally, he has developed a method for silicon wafers with a (111) plane orientation, which employs isotropic film stress to achieve similar results. Another notable patent involves predicting the warpage of silicon wafers during heat treatment, taking into account the effects of oxygen. This method includes determining mobile dislocation density and stress, which are crucial for understanding the warpage caused during processing.

Career Highlights

Bong-Gyun Ko has worked with notable companies such as Sumco Corporation and Toshiba Corporation. His experience in these organizations has allowed him to refine his expertise in semiconductor manufacturing and innovation.

Collaborations

Throughout his career, he has collaborated with esteemed colleagues, including Tetsuya Nakai and Takeshi Hamamoto. These partnerships have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Bong-Gyun Ko's innovative work in semiconductor technology has led to significant advancements in the production and processing of silicon wafers. His contributions continue to influence the industry and pave the way for future innovations.