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Chandler, AZ, United States of America

Bogdan M Simion

This inventor holds 6 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2010-2018.

USPTO Granted Patents = 6

% Patents Active = 33.3

Average Co-Inventor Count = 1.1

ph-index = 2

Forward Citations = 10(Granted Patents)

Company Filing History:

6 out of 56,184

Intel Corporation

Years Active: 2010-2018

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9899362 - Mold chase for integrated circuit package assembly and associated techniques and configurations (2018-02-20),

2. 9067342 - Mold chase for integrated circuit package assembly and associated techniques and configurations (2015-06-30),

3. 8534574 - Underfill material dispenser (2013-09-17),

4. 8366982 - Differential pressure underfill process and equipment (2013-02-05),

5. 8211501 - Fluorination pre-treatment of heat spreader attachment indium thermal interface material (2012-07-03),

6. 7829195 - Fluorination pre-treatment of heat spreader attachment indium thermal interface material (2010-11-09),

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