The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Apr. 08, 2010
Applicants:
Bogdan M Simion, Chandler, AZ (US);
Curtis S. White, Phoenix, AZ (US);
Sung-won Moon, Phoenix, AZ (US);
Inventors:
Bogdan M Simion, Chandler, AZ (US);
Curtis S. White, Phoenix, AZ (US);
Sung-Won Moon, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05B 1/28 (2006.01); B05B 1/24 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present disclosure relate to the field of depositing an underfill material between a microelectronic die and a substrate for flip-chip packages with an underfill material dispenser. In at least one embodiment, an underfill material dispenser may include a heater having a plurality of conduits. Other embodiments of the present disclosure may further include multiple dispense needle configurations, angled dispense nozzle exit conduits, conical nozzle exit conduits, and satellite traps.