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For the Inventor, By the Inventor

Incheon, South Korea

Bo Mook Chung

This inventor holds 6 USPTO granted patents and 6 published patent applications. Top assignees: Ymt Co., Ltd., Ymt Co., Ltd.. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bo Mook Chung. Retrieved from https://idiyas.com/inventor/bo-mook-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 6 

% Patents Active = 100.0

Average Co-Inventor Count = 4.1

ph-index = 1


Company Filing History:

goldMedal5 out of 8 
 
Ymt Co., Ltd.
 patents
silverMedal1 out of 1 
 
Ymt Co., Ltd.
 patent

Years Active: 2022-2026

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6 patents (USPTO):Explore Patents
1. 12534426 - Leveler and electroplating composition for filling via hole (2026-01-27),
2. 12522559 - Leveling agent and electrolytic composition for filling via hole (2026-01-13),
3. 12495494 - Metal foil, carrier with metal foil comprising the same and printed circuit board including the same (2025-12-09),
4. 12408279 - Release layer for metal foil with carrier and metal foil comprising the same (2025-09-02),
5. 12139811 - Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the same (2024-11-12),
6. 11499233 - Plated laminate and printed circuit board (2022-11-15),

Title: Bo Mook Chung: Innovator in Metal Foil Technology

Introduction

Bo Mook Chung is a prominent inventor based in Incheon, South Korea. He has made significant contributions to the field of metal foil technology, holding a total of 6 patents. His innovative work focuses on enhancing the efficiency and effectiveness of printed circuit boards through advanced materials.

Latest Patents

Chung's latest patents include a metal foil with a rough surface, which is designed to improve adhesive strength to insulating resin substrates. This innovation allows for the manufacturing of printed circuit boards with enhanced efficiency. Another notable patent is a release layer for a metal foil with a carrier, which facilitates the easy removal of the carrier. This release layer incorporates nitrogenous heterocyclic compounds and various inorganic compounds containing metals such as nickel and molybdenum.

Career Highlights

Chung is currently employed at YMT Co., Ltd., where he continues to develop cutting-edge technologies in the field of metal foils. His work has been instrumental in advancing the capabilities of printed circuit boards, making them more efficient and reliable.

Collaborations

Chung collaborates with talented coworkers, including Sung Wook Chun and Dea Geun Kim. Their combined expertise contributes to the innovative projects at YMT Co., Ltd.

Conclusion

Bo Mook Chung is a key figure in the advancement of metal foil technology, with a focus on improving printed circuit board manufacturing. His contributions are paving the way for future innovations in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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