The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Jul. 29, 2022
Applicant:
Ymt Co., Ltd., Incheon, KR;
Inventors:
Sung Wook Chun, Incheon, KR;
Bo Mook Chung, Incheon, KR;
Dea Geun Kim, Incheon, KR;
Nak Eun Ko, Bucheon-si, KR;
Ju Yong Sim, Seoul, KR;
Assignee:
YMT CO., LTD., Incheon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07C 217/76 (2006.01); C07D 213/30 (2006.01); C23C 18/16 (2006.01); C23C 18/38 (2006.01); C23C 28/02 (2006.01); C25D 3/38 (2006.01); C25D 5/18 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
C07C 217/76 (2013.01); C07D 213/30 (2013.01); C23C 18/1653 (2013.01); C23C 18/38 (2013.01); C23C 28/023 (2013.01); C25D 3/38 (2013.01); C25D 5/18 (2013.01); H05K 3/425 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01);
Abstract
The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.
Chun, Sung. (2026). Leveling agent and electrolytic composition for filling via hole (U.S. Patent No. 12522559). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12522559
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile