The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Oct. 14, 2019
Applicant:
Ymt Co., Ltd., Incheon, KR;
Inventors:
Assignee:
YMT CO., LTD., Incheon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/05 (2006.01); C23C 18/38 (2006.01); C23C 18/18 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
C23C 18/38 (2013.01); C23C 18/1886 (2013.01); H05K 1/05 (2013.01); H05K 3/181 (2013.01); H05K 2201/0302 (2013.01); H05K 2201/0332 (2013.01); H05K 2201/0344 (2013.01); H05K 2201/0364 (2013.01); H05K 2203/072 (2013.01);
Abstract
Provided is a plating lamination technology for providing a highly adhesive inner layer of a printed circuit board. The plating lamination technology is effective in providing an electroless plated laminate, including a non-etched/low-roughness pretreated laminate or a low-roughness copper foil, and a printed circuit board including the plated laminate.
Chun, Sung. (2022). Plated laminate and printed circuit board (U.S. Patent No. 11499233). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11499233
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile