This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Ymt Co., Ltd.. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: Myong Whan Park: Innovator in Plated Laminate Technology
Introduction
Myong Whan Park is a notable inventor based in Incheon, South Korea. He has made significant contributions to the field of printed circuit board technology. His innovative work focuses on enhancing the adhesion and quality of laminates used in electronic applications.
Latest Patents
Myong Whan Park holds a patent for a plating lamination technology that provides a highly adhesive inner layer of a printed circuit board. This technology is effective in creating an electroless plated laminate, which includes a non-etched or low-roughness pretreated laminate or a low-roughness copper foil. His patent is crucial for improving the performance and reliability of printed circuit boards.
Career Highlights
Park is associated with YMT Co., Ltd., where he applies his expertise in laminate technology. His work has been instrumental in advancing the capabilities of printed circuit boards, making them more efficient and reliable for various electronic applications.
Collaborations
He has collaborated with notable colleagues, including Sung Wook Chun and Bo Mook Chung, to further enhance the development of innovative technologies in the field.
Conclusion
Myong Whan Park's contributions to plating lamination technology have made a significant impact on the printed circuit board industry. His innovative approach continues to influence advancements in electronic manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile