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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12534426 B1

PDFFull Text
Date of Patent:
Jan. 27, 2026

Filed:

Jun. 27, 2023

Leveler and electroplating composition for filling via hole

Applicant:

Ymt Co., Ltd., Incheon, KR;

Inventors:

Dea Geun Kim, Incheon, KR;

Sung Wook Chun, Incheon, KR;

Bo Mook Chung, Incheon, KR;

Nak Eun Ko, Bucheon-si, KR;

Assignee:

YMT CO., LTD., Incheon, KR;

Attorney:

STIP Law Group, LLC

Primary Examiner:

Charanjit Aulakh

Int. Cl.
CPC ...
C07D 401/14 (2006.01); C07C 217/76 (2006.01); C07D 233/64 (2006.01); C07D 241/12 (2006.01); C09K 11/00 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
C07C 217/76 (2013.01); C07D 233/64 (2013.01); C07D 241/12 (2013.01); C25D 3/38 (2013.01);
Abstract

The present invention relates to a leveler capable of efficiently filling the inside of via holes formed during the manufacturing process of a printed circuit board, and an electroplating composition comprising the same. When via holes on a substrate are filled with the electroplating composition according to the present invention, the via holes can be filled in a relatively short time while minimizing the formation of dimples or voids.

Find Patent Forward Citations

Kim, Dea. (2026). Leveler and electroplating composition for filling via hole (U.S. Patent No. 12534426). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12534426

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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