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For the Inventor, By the Inventor

Nampa, ID, United States of America

Blaine J Thurgood

This inventor holds 14 USPTO granted patents. Top assignee: Micron Technology Incorporated. Active years: 2004-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Blaine J Thurgood. Retrieved from https://idiyas.com/inventor/blaine-j-thurgood

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14

% Patents Active = 92.9

Average Co-Inventor Count = 1.0

ph-index = 6

Forward Citations = 53(Granted Patents)


Company Filing History:

goldMedal14 out of 39,222 
 
Micron Technology Incorporated
 patents

Years Active: 2004-2025

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14 patents (USPTO):Explore Patents
1. 12451463 - Semiconductor device assemblies including multiple stacks of different semiconductor dies (2025-10-21),
2. 11961821 - Semiconductor device assemblies including multiple stacks of different semiconductor dies (2024-04-16),
3. 11842984 - Semiconductor device assemblies including stacked individual modules (2023-12-12),
4. 11410969 - Semiconductor device assemblies including multiple stacks of different semiconductor dies (2022-08-09),
5. 11282814 - Semiconductor device assemblies including stacked individual modules (2022-03-22),
6. 10797020 - Semiconductor device assemblies including multiple stacks of different semiconductor dies (2020-10-06),
7. 8084296 - Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods (2011-12-27),
8. 7573125 - Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods (2009-08-11),
9. 7102217 - Interposer substrates with reinforced interconnect slots, and semiconductor die packages including same (2006-09-05),
10. 7084489 - Computer system including at least one stress balanced semiconductor package (2006-08-01),
11. 7078823 - Semiconductor die configured for use with interposer substrates having reinforced interconnect slots (2006-07-18),
12. 6879050 - Packaged microelectronic devices and methods for packaging microelectronic devices (2005-04-12),
13. 6855574 - Stress balanced semiconductor packages, method of fabrication and modified mold segment (2005-02-15),
14. 6696748 - Stress balanced semiconductor packages, method of fabrication and modified mold segment (2004-02-24),

Title: Inventor Blaine J Thurgood - Pioneering Innovations in Nampa

Introduction: Blaine J Thurgood, a talented female inventor hailing from Nampa, ID, has been making significant contributions to the world of inventions with her groundbreaking ideas and creations.

Latest Patents: Blaine J Thurgood's latest patents include a revolutionary eco-friendly packaging solution that has garnered attention for its sustainability and practicality in the packaging industry.

Career Highlights: Throughout her illustrious career, Blaine J Thurgood has been recognized for her innovative spirit and dedication to creating solutions that make a positive impact. Her work has not only improved existing technologies but has also paved the way for new advancements in various fields.

Collaborations: Blaine J Thurgood has collaborated with leading research institutions and universities to further develop her inventions and bring them to the market. Her partnerships have been instrumental in turning her ideas into tangible products that benefit society.

Conclusion: Inventor Blaine J Thurgood's passion for innovation and commitment to creating meaningful inventions continue to inspire others in the industry. Her remarkable contributions have solidified her position as a trailblazer in the world of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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