Company Filing History:
8 out of 618 
1 out of 2,426 
1 out of 4,872 
Years Active: 2017-2023
Title: Benoit Besancon: Innovator in Electronic Packaging
Introduction
Benoit Besancon is a notable inventor based in Villard Bonnot, France. He has made significant contributions to the field of electronic packaging, holding a total of 8 patents. His innovative methods have advanced the way electronic packages are manufactured, particularly in the integration of optical components.
Latest Patents
Benoit Besancon's latest patents include a method for manufacturing a cover for an electronic package and an electronic package comprising a cover. The first patent describes a process where an optical insert is placed between two opposite faces of a mold cavity. This insert is designed to allow light radiation to pass through. A coating material is then injected into the cavity, surrounding the optical insert to create a substrate that is overmolded around it, resulting in a protective cover for the electronic package. The second patent outlines a similar method for manufacturing an encapsulation cover, emphasizing the injection of coating material around an insert to form a durable cover.
Career Highlights
Benoit has worked with prominent companies in the electronics sector, including STMicroelectronics. His experience at STMicroelectronics has allowed him to refine his skills and contribute to cutting-edge technologies in electronic packaging.
Collaborations
Throughout his career, Benoit has collaborated with talented individuals such as Karine Saxod and Alexandre Mas. These partnerships have fostered innovation and creativity in his projects.
Conclusion
Benoit Besancon's work in electronic packaging exemplifies the spirit of innovation. His patents and collaborations reflect a commitment to advancing technology in this critical field.