The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Jun. 26, 2017
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Stmicroelectronics SA, Montrouge, FR;
Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Didier Campos, Charavines, FR;
Benoit Besancon, Villard Bonnot, FR;
Perceval Coudrain, Grenoble, FR;
Jean-Philippe Colonna, Corenc, FR;
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
STMicroelectronics SA, Montrouge, FR;
Commissariat A L'Energie Atomique et aux Energies Alternatives, Paris, FR;
Abstract
Electronic devices are manufactured using a collective (wafer-scale) fabrication process. Electronic chips are mounted onto one face of a collective substrate wafer. A collective flexible sheet made of a heat-conductive material comprising a layer containing pyrolytic graphite is fixed to extend over a collective region extending over the electronic chips and over the collective substrate wafer between the electronic chips. The collective flexible sheet is then compressed. A dicing operation is then carried out in order to obtain electronic devices each including an electronic chip, a portion of the collective plate and a portion of the collective flexible sheet.