The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Aug. 24, 2017
Applicant:
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Inventors:
Benoit Besancon, Villard Bonnot, FR;
Alexandre Mas, Saint Egreve, FR;
Karine Saxod, Les Marches, FR;
Assignee:
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/053 (2006.01); H01L 23/06 (2006.01); H01L 23/10 (2006.01); H01L 23/24 (2006.01); H01L 23/42 (2006.01); H01L 23/433 (2006.01); H01L 21/52 (2006.01); H01L 23/04 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 21/4803 (2013.01); H01L 21/52 (2013.01); H01L 23/04 (2013.01); H01L 23/053 (2013.01); H01L 23/06 (2013.01); H01L 23/10 (2013.01); H01L 23/24 (2013.01); H01L 23/315 (2013.01); H01L 23/3192 (2013.01); H01L 23/42 (2013.01); H01L 23/4334 (2013.01); H01L 23/552 (2013.01);
Abstract
A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.