The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Sep. 25, 2019
Method for manufacturing a cover for an electronic package and electronic package comprising a cover
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Karine Saxod, Les Marches, FR;
Alexandre Mas, Saint Egreve, FR;
Eric Saugier, Froges, FR;
Gaetan Lobascio, Moirans, FR;
Benoit Besancon, Villard Bonnot, FR;
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
Abstract
A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.