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For the Inventor, By the Inventor

Guangzhou, China

Bei Chen

This inventor holds 5 USPTO granted patents and 1 EPO patent. Top assignees: Guangzhou Fastprint Circuit Tech Co., Ltd., Shenzhen Fastprint Circuit Tech Co., Ltd., Yixing Silicon Valley Electronics Technology Co., Ltd.. Active years: 2017-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bei Chen. Retrieved from https://idiyas.com/inventor/bei-chen-whnitafd

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.3

ph-index = 1


Location History:

  • Guangdong, CN (2018)
  • Guangzhou, CN (2017 - 2021)

Company Filing History:

goldMedal5 out of 8 
 
Guangzhou Fastprint Circuit Tech Co., Ltd.
 patents
silverMedal5 out of 8 
 
Shenzhen Fastprint Circuit Tech Co., Ltd.
 patents
bronzeMedal4 out of 4 
 
Yixing Silicon Valley Electronics Technology Co., Ltd.
 patents
4. 1 out of 1 
 
Yixing Silicon Valley Electronics Tech Co., Ltd.
 patent
where one patent can have more than one assignee

Years Active: 2017-2021

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5 patents (USPTO):Explore Patents
1. 11083091 - Hole connecting layer manufacturing method, circuit board manufacturing method and circuit board (2021-08-03),
2. 10433422 - High-speed printed circuit board and differential wiring method thereof (2019-10-01),
3. 10064284 - Drilling method for PCBs with high hole position precision (2018-08-28),
4. 9942976 - Preparation method of a boss-type metal-based sandwich rigid-flex circuit board (2018-04-10),
5. 9706669 - Rigid-flexible circuit board having flying-tail structure and method for manufacturing same (2017-07-11),

Title: Innovations of Bei Chen in Circuit Board Technology

Introduction

Bei Chen is a notable inventor based in Guangzhou, China. He has made significant contributions to the field of circuit board technology, holding a total of 5 patents. His work focuses on advanced manufacturing methods that enhance the efficiency and performance of circuit boards.

Latest Patents

Among his latest patents are the "Hole Connecting Layer Manufacturing Method" and the "Circuit Board Manufacturing Method." The hole connecting layer manufacturing method involves adhering insulating dielectric layers to a daughter board, creating receiving holes, and filling them with a conductive medium to complete the manufacturing process. Additionally, his differential wiring method for high-speed printed circuit boards outlines steps for setting impedance values and arranging differential wires to optimize performance.

Career Highlights

Bei Chen has worked with prominent companies such as Guangzhou Fastprint Circuit Tech Co., Ltd. and Shenzhen Fastprint Circuit Tech Co., Ltd. His experience in these organizations has allowed him to apply his innovative ideas in practical settings, contributing to advancements in circuit board technology.

Collaborations

Some of his notable coworkers include Zeyang Lian and Sen Wu, who have collaborated with him on various projects in the field.

Conclusion

Bei Chen's contributions to circuit board technology through his patents and career experiences highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of circuit board manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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