Guangzhou Fastprint Circuit Tech Co., Ltd.

Shenzhen Fastprint Circuit Tech Co., Ltd.

Yixing Silicon Valley Electronics Technology Co., Ltd.

Yixing Silicon Valley Electronics Tech Co., Ltd.

Bei Chen

Bo Xu

Hongfei Wang

Wenjiao Xie

Xingya Qiu

Hong Fan

Chutao Lin

Xinman Mo

Sen Wu

Xiaolang Ren

Zeyang Lian

Yanguo Li

Zhijun Zeng

Disclosed are a hole connecting layer manufacturing method, a circuit board manufacturing method and a circuit board. The hole connecting layer manufacturing method comprises: adhering a first insulating dielectric layer, used for laminating and filling, to a daughter board; laminating and solidifying the first insulating dielectric layer on the daughter board; adhering a second insulating dielectric layer, used for laminating and filling, to the first insulating dielectric layer which has been laminated and solidified; manufacturing a first receiving hole on the first insulating dielectric layer and a second receiving hole on the second insulating dielectric layer, wherein the first receiving hole and the second receiving hole are provided vertically opposite to each other; filling both the first receiving hole and the second receiving hole with a conductive medium to complete manufacturing of the hole connecting layer.

Hole connecting layer manufacturing method, circuit board manufacturing method and circuit board

Provided is a differential wiring method for a high-speed printed circuit board, including the following steps: setting a pre-set impedance required value Zof a non-ball grid array (BGA) region, determining the width wof the second differential wire and the distance dbetween the two second differential wires according to the pre-set impedance required value Z; calculating the width wof the first differential wire and the distance dbetween the two first differential wires, according to the distance sbetween two adjacent rows of bonding pads in a BGA region bonding pad array and the minimum processable distance sbetween the bonding pad and the first differential wire, where wand dshould satisfy 2w+d&#x2264;s&#x2212;2s, while further calculating wand daccording to a differential characteristic impedance formula; arranging the two first differential wires disposed oppositely to each other in the BGA region according to the determined d, and arranging the two second differential wires disposed oppositely to each other in the non-BGA region according to the determined d; connecting the first differential wire and the second differential wire corresponding thereto via a first connection wire; and connecting the first differential wire and the bonding pad corresponding thereto via a second connection wire.

High-speed printed circuit board and differential wiring method thereof

Disclosed is a drilling method for PCBs with high hole position precision, comprising: step 1 of fixing a PCB on a workbench; step 2 of pre-drilling a to-be-drilled portion of the PCB by using a short-blade drilling tool; and step 3 of deeply drilling the to-be-drilled portion which has been machined in step 2 by using along-blade drilling tool. The PCB is fixed in step 1 to prevent the PCB from moving during drilling which otherwise would affect the drilling precision; the to-be-drilled portion of the PCB is pre-drilled by using a short-blade drilling tool in step 2, and the short-blade drilling tool has a higher rigidity than along-blade drilling tool and thus will not easily slide at the moment of contacting the surface of the PCB; and the to-be-drilled portion which has been machined in step 2 is deep drilled by using the long-blade drilling tool in step 3, and the long-blade drilling tool has reduced sliding upon entry, thus guaranteeing the entry alignment of the long-blade drilling tool in the case of deep drilling, so that the drilled hole meets the requirement of high hole position precision for PCBs.

Drilling method for PCBs with high hole position precision

A boss-type metal-based sandwich rigid-flex board and preparation method thereof are disclosed. The boss-type metal-based sandwich rigid-flex board comprises a rigid sub-plate, a flexible sub-plate, a dielectric layer, and a metal core layer, wherein the metal core layer has front and back sides on which at least one metal boss and at least one heat dissipation area are arranged respectively, the dielectric layer, and the rigid sub-plate and/or the flexible sub-plate are sequentially stacked on the front and back sides of the metal core layer respectively, and each of the rigid sub-plate, the flexible sub-plate and the dielectric layer is provided with a first window area fit with the metal boss, and a second window area corresponding to the heat dissipation area. The boss-type metal-based sandwich rigid-flex board (with a metal boss and a heat dissipation area arranged on the front side) prepared according to the present disclosure uses a metal core layer for heat dissipation. In this way, not only the need of heat dissipation of the locally heating electronic components (through the metal boss) but also the heat dissipation of the high density wirings at work can be satisfied (through the metal core layer and the heat dissipation area) with good reliability.

Preparation method of a boss-type metal-based sandwich rigid-flex circuit board

Provided is a method for manufacturing a rigid-flexible circuit board having a flying-tail structure, comprising the following steps: step 1: manufacturing core substrates needed by daughter boards (), the cord boards needed by each daughter board comprising at least one flexible core substrate () and at least one rigid core substrate (), stacking and laminating the core substrates to manufacture daughter boards, the number of the manufactured daughter boards being equal to the number of second rigid areas (), and each daughter board comprising a partial first rigid area (), a flexible area (), and a second rigid area (); step 2, stacking the daughter boards obtained in step 1, and pasting polyetherimide covering films () on solder-resist areas of adjacent end surfaces of the second rigid areas; and step 3, providing PTFE gaskets () between adjacent flexible areas and adjacent second rigid areas, laminating the daughter boards that have been processed in step 2, and laminating the partial first rigid areas of the daughter plates together to form a first rigid area (). Also provided is a rigid-flexible circuit board having a flying-tail structure. The method for manufacturing a rigid-flexible circuit board having a flying-tail structure can effectively prevent the solder-resist layer from being damaged.

Rigid-flexible circuit board having flying-tail structure and method for manufacturing same

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Guangzhou, China

Bei Chen