The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Dec. 29, 2017
Guangzhou Fastprint Circuit Tech Co., Ltd., Guangzhou, CN;
Shenzhen Fastprint Circuit Tech Co., Ltd., Shenzhen, CN;
Yixing Silicon Valley Electronics Tech Co., Ltd., Yixing, CN;
Zeyang Lian, Guangzhou, CN;
Sen Wu, Guangzhou, CN;
Yanguo Li, Guangzhou, CN;
Bei Chen, Guangzhou, CN;
GUANGZHOU FASTPRINT CIRCUIT TECH CO., LTD., Guangdong, CN;
SHENZHEN FASTPRINT CIRCUIT TECH CO., LTD., Guangdong, CN;
YIXING SILICON VALLEY ELECTRONICS TECH CO., LTD., Jiangsu, CN;
Abstract
Disclosed are a hole connecting layer manufacturing method, a circuit board manufacturing method and a circuit board. The hole connecting layer manufacturing method comprises: adhering a first insulating dielectric layer, used for laminating and filling, to a daughter board; laminating and solidifying the first insulating dielectric layer on the daughter board; adhering a second insulating dielectric layer, used for laminating and filling, to the first insulating dielectric layer which has been laminated and solidified; manufacturing a first receiving hole on the first insulating dielectric layer and a second receiving hole on the second insulating dielectric layer, wherein the first receiving hole and the second receiving hole are provided vertically opposite to each other; filling both the first receiving hole and the second receiving hole with a conductive medium to complete manufacturing of the hole connecting layer.