Sen Wu

Title: The Innovative Contributions of Sen Wu

Introduction

Sen Wu is a notable inventor based in Guangzhou, China. He has made significant contributions to the field of circuit board manufacturing. His innovative methods have paved the way for advancements in electronic technology.

Latest Patents

Sen Wu holds a patent for a "Hole connecting layer manufacturing method, circuit board manufacturing method and circuit board." This patent discloses a method that involves adhering a first insulating dielectric layer to a daughter board, laminating and solidifying it, and then adhering a second insulating dielectric layer. The process includes creating receiving holes and filling them with a conductive medium to complete the manufacturing of the hole connecting layer. This invention enhances the efficiency and reliability of circuit boards.

Career Highlights

Throughout his career, Sen Wu has worked with prominent companies in the electronics sector. He has been associated with Shenzhen Fastprint Circuit Tech Co., Ltd. and Yixing Silicon Valley Electronics Tech Co., Ltd. His experience in these companies has contributed to his expertise in circuit board technology.

Collaborations

Sen Wu has collaborated with talented individuals in his field, including Yanguo Li and Zeyang Lian. These collaborations have fostered innovation and development in circuit board manufacturing techniques.

Conclusion

Sen Wu's contributions to the field of circuit board manufacturing through his innovative patent and collaborations highlight his importance as an inventor. His work continues to influence advancements in electronic technology.