Guangzhou, China

Yanguo Li

This inventor holds 1 USPTO granted patent. Top assignees: Guangzhou Fastprint Circuit Tech Co., Ltd., Shenzhen Fastprint Circuit Tech Co., Ltd., Yixing Silicon Valley Electronics Tech Co., Ltd.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yanguo Li. Retrieved from https://idiyas.com/inventor/yanguo-li

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Yanguo Li - Innovator in Circuit Board Manufacturing

Introduction

Yanguo Li is a notable inventor based in Guangzhou, China. He has made significant contributions to the field of circuit board manufacturing. His innovative methods have paved the way for advancements in electronic components.

Latest Patents

Yanguo Li holds a patent for a "Hole connecting layer manufacturing method, circuit board manufacturing method and circuit board." This patent discloses a method that involves adhering a first insulating dielectric layer to a daughter board, laminating and solidifying it, and then adhering a second insulating dielectric layer. The process includes creating receiving holes and filling them with a conductive medium to complete the manufacturing of the hole connecting layer. He has 1 patent to his name.

Career Highlights

Throughout his career, Yanguo Li has worked with several companies, including Guangzhou Fastprint Circuit Tech Co., Ltd. and Yixing Silicon Valley Electronics Tech Co., Ltd. His experience in these organizations has contributed to his expertise in circuit board technologies.

Collaborations

Yanguo Li has collaborated with notable coworkers such as Bei Chen and Zeyang Lian. Their joint efforts have further enhanced the development of innovative solutions in the electronics industry.

Conclusion

Yanguo Li's contributions to circuit board manufacturing demonstrate his commitment to innovation and excellence in technology. His patent and career achievements reflect his significant impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…