Zeyang Lian

Title: Zeyang Lian: Innovator in Circuit Board Manufacturing

Introduction

Zeyang Lian is a notable inventor based in Guangzhou, China. He has made significant contributions to the field of circuit board manufacturing. His innovative methods have paved the way for advancements in electronic components.

Latest Patents

Zeyang Lian holds a patent for a "Hole connecting layer manufacturing method, circuit board manufacturing method and circuit board." This patent discloses a method that involves adhering insulating dielectric layers to a daughter board, laminating and solidifying these layers, and creating receiving holes filled with a conductive medium. This innovative approach enhances the manufacturing process of circuit boards.

Career Highlights

Throughout his career, Zeyang Lian has worked with prominent companies such as Shenzhen Fastprint Circuit Technology Co., Ltd. and Guangzhou Fastprint Circuit Technology Co., Ltd. His experience in these organizations has contributed to his expertise in circuit board technology.

Collaborations

Zeyang Lian has collaborated with talented individuals in his field, including Yanguo Li and Bei Chen. These partnerships have fostered innovation and development in circuit board manufacturing techniques.

Conclusion

Zeyang Lian's contributions to circuit board manufacturing through his innovative patent and collaborative efforts highlight his importance in the field. His work continues to influence advancements in electronic technology.