High-speed printed circuit board and differential wiring method thereof

Abstract

Provided is a differential wiring method for a high-speed printed circuit board, including the following steps: setting a pre-set impedance required value Zof a non-ball grid array (BGA) region, determining the width wof the second differential wire and the distance dbetween the two second differential wires according to the pre-set impedance required value Z; calculating the width wof the first differential wire and the distance dbetween the two first differential wires, according to the distance sbetween two adjacent rows of bonding pads in a BGA region bonding pad array and the minimum processable distance sbetween the bonding pad and the first differential wire, where wand dshould satisfy 2w+d≤s−2s, while further calculating wand daccording to a differential characteristic impedance formula; arranging the two first differential wires disposed oppositely to each other in the BGA region according to the determined d, and arranging the two second differential wires disposed oppositely to each other in the non-BGA region according to the determined d; connecting the first differential wire and the second differential wire corresponding thereto via a first connection wire; and connecting the first differential wire and the bonding pad corresponding thereto via a second connection wire.