Barry T Dale

Title: Innovations of Barry T. Dale

Introduction

Barry T. Dale is an accomplished inventor based in Dupont, WA (US). He has made significant contributions to the field of electronic device design, holding a total of 3 patents. His work primarily focuses on hinge assemblies and land-grid array sockets, showcasing his expertise in innovative engineering solutions.

Latest Patents

One of Barry's latest patents is for a hinge assembly designed for electronic devices. This invention includes a chassis with a first and second section, connected by a first hinge assembly and a second hinge assembly. The design incorporates a rigid connecting member and resistance elements to provide controlled rotational resistance, enhancing the functionality of electronic devices.

Another notable patent is for integrated translational land-grid array sockets and loading mechanisms for semiconductive devices. This invention features a land-grid array die package socket that allows for low- or zero insertion-force assembly. The design includes a motion plate that facilitates the insertion of the die package into the socket, ensuring a reliable connection with minimal effort.

Career Highlights

Barry T. Dale is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. His work at Intel has allowed him to contribute to cutting-edge technologies that impact various electronic devices.

Collaborations

Throughout his career, Barry has collaborated with talented individuals such as Russell S. Aoki and Anthony P. Valpiani. These collaborations have fostered a creative environment that encourages the development of innovative solutions in the tech industry.

Conclusion

Barry T. Dale's contributions to the field of electronic device design through his patents and work at Intel Corporation highlight his role as a significant innovator. His inventions continue to influence the development of advanced technologies in the electronics sector.