The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2016

Filed:

Jul. 30, 2013
Applicants:

Tod A. Byquist, Federal Way, WA (US);

Peter Bristol, Seattle, WA (US);

Michael S. Brazel, Fedeal Way, WA (US);

Kristin L. Weihl, Dupont, WA (US);

Stella Latscha, Porland, OR (US);

Alexander D. Williams, DuPont, WA (US);

Nicolas Kurczewski, Dupont, WA (US);

Barry T. Dale, DuPont, WA (US);

Robert R. Atkinson, Jr., Chandler, AZ (US);

Stephen J. Allen, Santa Clara, CA (US);

Patrick S. Johnson, Olympia, WA (US);

Inventors:

Tod A. Byquist, Federal Way, WA (US);

Peter Bristol, Seattle, WA (US);

Michael S. Brazel, Fedeal Way, WA (US);

Kristin L. Weihl, Dupont, WA (US);

Stella Latscha, Porland, OR (US);

Alexander D. Williams, DuPont, WA (US);

Nicolas Kurczewski, Dupont, WA (US);

Barry T. Dale, DuPont, WA (US);

Robert R. Atkinson, Jr., Chandler, AZ (US);

Stephen J. Allen, Santa Clara, CA (US);

Patrick S. Johnson, Olympia, WA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); E05D 11/08 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1681 (2013.01); E05D 11/08 (2013.01); G06F 1/162 (2013.01); G06F 1/1618 (2013.01); G06F 1/1679 (2013.01); Y10T 16/5403 (2015.01);
Abstract

In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.


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