Intel Corporation

Barry T Dale

Chia-Pin Chiu

Russell S Aoki

Anthony P Valpiani

Peter Wesley Bristol

Tod A Byquist

Michael S Brazel

Robert R Atkinson

Patrick S Johnson

Nicolas A Kurczewski

Stephen J Allen

Kristin L Weihl

Stella Latscha

Alexander D Williams

In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.

Hinge assembly

A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.

Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices

Growing community of inventors

Dupont, WA, United States of America

Barry T Dale