Company Filing History:
Years Active: 2017-2023
Title: The Innovative Contributions of Baris Bicen
Introduction
Baris Bicen is a prominent inventor based in Chandler, Arizona, known for his significant contributions to the field of integrated circuit packaging and piezoelectric materials. With a total of 11 patents to his name, Bicen has made remarkable advancements that enhance the functionality and efficiency of electronic devices.
Latest Patents
Among his latest patents, Bicen has developed a multi-package assembly that incorporates foam structures for warpage control. This innovative integrated circuit package features a substrate with a mold material layer and a signal routing layer. The mold material layer includes at least one bridge and foam structure, which aids in device-to-device interconnection between integrated circuit devices. Another notable patent involves inorganic piezoelectric materials formed on fibers. This invention includes an active fiber with a piezoelectric layer that can withstand high temperatures, showcasing Bicen's expertise in advanced materials.
Career Highlights
Bicen's career is marked by his role at Intel Corporation, where he has been instrumental in driving innovation in electronic packaging technologies. His work has not only contributed to the company's success but has also set new standards in the industry.
Collaborations
Throughout his career, Bicen has collaborated with talented individuals such as Feras Eid and Johanna M Swan. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Baris Bicen's contributions to the field of electronics through his patents and innovative ideas have made a lasting impact. His work continues to inspire future advancements in technology and materials science.