The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Apr. 01, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Sasha N. Oster, Marion, IA (US);

Feras Eid, Chandler, AZ (US);

Johanna M. Swan, Scottsdale, AZ (US);

Shawna M. Liff, Scottsdale, AZ (US);

Aleksandar Aleksov, Chandler, AZ (US);

Thomas L. Sounart, Chandler, AZ (US);

Baris Bicen, Chandler, AZ (US);

Valluri R. Rao, Saratoga, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 26/00 (2006.01); G02B 26/08 (2006.01); H01L 41/047 (2006.01); H01L 41/27 (2013.01); H01L 41/314 (2013.01); H01L 41/332 (2013.01);
U.S. Cl.
CPC ...
G02B 26/0858 (2013.01); H01L 41/047 (2013.01); H01L 41/27 (2013.01); H01L 41/314 (2013.01); H01L 41/332 (2013.01);
Abstract

Embodiments of the invention include a piezo-electric mirror in an microelectronic package and methods of forming the package. According to an embodiment the microelectronic package may include an organic substrate with a cavity formed in the organic substrate. In some embodiments, an actuator is anchored to the organic substrate and extends over the cavity. For example, the actuator may include a first electrode and a piezo-electric layer formed on the first electrode. A second electrode may be formed on the piezo-electric layer. Additionally, a mirror may be formed on the actuator. Embodiments allow for the piezo-electric layer to be formed on an organic package substrate by using low temperature crystallization processes. For example, the piezo-electric layer may be deposited in an amorphous state. Thereafter, a laser annealing process that includes a pulsed laser may be used to crystallize the piezo-electric layer.


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