Location History:
- Tsukuba, JP (1997 - 1998)
- Kawasaki, JP (2000)
- Chiba, JP (2003)
- Futtsu, JP (2003 - 2007)
Company Filing History:
Years Active: 1997-2007
Title: Atsushi Ikari: Innovator in Wafer Technology
Introduction
Atsushi Ikari is a prominent inventor based in Tsukuba, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of innovative solutions for silicon wafer processing. With a total of 7 patents to his name, Ikari's work has had a substantial impact on the industry.
Latest Patents
Ikari's latest patents include advancements in wafer holding, wafer support members, wafer boats, and heat treatment furnaces. His inventions are designed to effectively suppress slip dislocations during high-temperature heat treatment of silicon wafers, all while maintaining productivity and minimizing costs. One notable invention is a wafer holder that consists of a wafer support plate and multiple wafer support members, including a tilting wafer support member with upward-convex wafer support portions. Additionally, he has developed a high-quality SOI substrate that enhances the yield and electric properties of LSI devices, achieved through the formation of an embedded oxide layer on a silicon single crystal substrate.
Career Highlights
Throughout his career, Ikari has worked with notable organizations such as Nippon Steel Corporation and the Research Development Corporation of Japan. His experience in these companies has allowed him to refine his expertise in semiconductor technology and contribute to various innovative projects.
Collaborations
Ikari has collaborated with several professionals in his field, including Koji Izunome and Souroku Kawanishi. These partnerships have further enriched his work and led to advancements in wafer technology.
Conclusion
Atsushi Ikari's contributions to the semiconductor industry through his patents and collaborations highlight his role as an influential inventor. His innovative solutions continue to shape the future of silicon wafer processing.