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For the Inventor, By the Inventor

Poughkeepsie, NY, United States of America

Arthur Bross

USPTO Granted Patents = 18

Average Co-Inventor Count = 3.2

ph-index = 9

Forward Citations = 508(Granted Patents)


Company Filing History:

goldMedal18 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1992-1996

where 'Filed Patents' based on already Granted Patents

18 patents (USPTO):
1. 5517751 - Multilayer microelectronic wiring module and method for forming the same (1996-05-21),
2. 5410807 - High density electronic connector and method of assembly (1995-05-02),
3. 5401911 - Via and pad structure for thermoplastic substrates and method and (1995-03-28),
4. 5399305 - Dynamic gating of polymers for isotropic properties (1995-03-21),
5. 5362360 - Method and product for extruding materials that exhibit anisotropic (1994-11-08),
6. 5338208 - High density electronic connector and method of assembly (1994-08-16),
7. 5326245 - Apparatus for extruding materials that exhibit anisotropic properties (1994-07-05),
8. 5324205 - Array of pinless connectors and a carrier therefor (1994-06-28),
9. 5312238 - Apparatus for extruding materials that exhibit anisotropic properties by (1994-05-17),
10. 5305523 - Method of direct transferring of electrically conductive elements into a (1994-04-26),
11. 5303862 - Single step electrical/mechanical connection process for connecting I/O (1994-04-19),
12. 5276964 - Method of manufacturing a high density connector system (1994-01-11),
13. 5259110 - Method for forming a multilayer microelectronic wiring module (1993-11-09),
14. 5251806 - Method of forming dual height solder interconnections (1993-10-12),
15. 5244378 - Apparatus for dynamic gating of polymers for producing molded articles (1993-09-14),

Title: **Arthur Bross: A Pioneer in Microelectronic Innovations**

Introduction

Arthur Bross is a distinguished inventor based in Poughkeepsie, NY, renowned for his significant contributions to the field of microelectronics. With an impressive portfolio of 18 patents, Bross has made a remarkable impact, particularly through his work in developing advanced wiring modules and electronic connectors.

Latest Patents

Among his latest innovations, Bross has secured two notable patents. The first is for a **Multilayer Microelectronic Wiring Module** and the method for its formation. This innovative module is created by laminating individual thermoplastic polymer sheets formed through various molding techniques, such as injection and compression. By incorporating metal pieces that form vias of specific shapes and sizes, Bross ensures that these vias create essential electrical connections between the top and bottom surfaces of the sheets.

The second patent is regarding a **High Density Electronic Connector Assembly**. This advanced assembly features two insulating portions designed to be mated precisely. A plurality of contact members arranged closely beneath the first portion complements a similar number of socket holes in the second portion. Each socket hole has a printed circuit land at its base, acting as a spring element that maintains normal contact force. The incorporation of small metal balls seated within these holes enhances the electrical connectivity when the two portions are fully mated.

Career Highlights

Bross is affiliated with the International Business Machines Corporation (IBM), where he has dedicated a significant part of his career to research and development in microelectronics. His innovative spirit and technical expertise have positioned him as a valued member of the engineering community.

Collaborations

Throughout his career, Bross has collaborated with fellow engineers Thomas J. Walsh and Robert O. Lussow, contributing to the development of cutting-edge technologies in their field. Together, they have pushed the boundaries of what is possible in microelectronics, paving the way for future advancements.

Conclusion

Arthur Bross is a pioneering inventor whose work has significantly advanced the field of microelectronics. Through his innovative patents and collaborations with esteemed colleagues at IBM, Bross continues to shape the future of electronic connectivity and microelectronic components. His contributions will undoubtedly leave a lasting legacy in the world of technology.

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