International Business Machines Corporation

Arthur Bross

Thomas J Walsh

Robert O Lussow

Donald E Myers

Julian G Cempa

James Gardner Ryan

Sudipta Kumar Ray

Kamalesh K Srivastava

Erick G Walton

Birendra N Agarwala

Paul A Totta

Karl J Puttlitz, Sr

Nicholas G Koopman

Aziz M Ahsan

Herbert R Anderson, Jr

Adolf E Wirsing

Li-Chung Lee

Joseph G Schaefer

Mark F Chadurjian

Thomas J Walsh, Iii

Joseph D Peruffo

Krishna Gandhi Sachdev

Umar M Ahmad

George Czornyj

Robert D Johnson

James A McDonald

Herbert W Anderson

James R Lyerla, Jr

Harry K Harrison

Richard R Jones

James J Hedrick

A multilayer microelectronics module formed by laminating together individual thermoplastic polymer sheets formed by injection, compression or other suitable molding techniques. Metal pieces to form vias of a desired shape and size are inserted into the molded sheets, preferably by in situ insert molding. The vias provide an electrical connection from the top to the bottom surfaces of the sheets.

Multilayer microelectronic wiring module and method for forming the same

There is disclosed a high density electronic connector assembly (system) having a first insulating portion and a second insulating portion adapted to be mated together and held in precise dimensional relation to each other with a suitable steady force. There are a plurality of contact members projecting down beneath the first portion on very close centers. There is a like plurality of socket holes in the second portion, with a respective printed-circuit (conductor) land at the bottom of each hole. Each land is adapted to act as a spring element to establish a minimum normal contact force. Seated in each hole is a small metal ball. Each ball is adapted to press against a respective contact member of the first portion when the upper and lower portions are fully mated. There is also disclosed a method of seating and re-flow soldering the balls to the respective lands in the socket holes.

High density electronic connector and method of assembly

An improved connection through a substrate layer is formed by embedding a conductive element such as a pin on one or more balls or spheres in a thermoplastic material which is preferably a liquid crystal polymer. The substrate may be heated to facilitate the embedding process in which material of the substrate layer is reflowed under pressure to retain the conductive element by means of a preload force. The formation of such connections with either pins or plural conductive elements allows independence of aspect ratio of the connection and, hence, feature size of conductive patterns on the substrate and the thickness of the substrate layer. Perfecting features of the substrate and method and apparatus for forming the substrate, embedding to a selected depth to form protrusions and recesses to assist in registration of a substrate layer with another substrate layer, metallization to form pads, improved connection between metallization patterns on the substrate and the conductive elements, the regulation of pressurization of substrate material by means of differently shaped dimples or a renewable surface and several alternative arrangements for positioning and embedding the conductive elements. Multiple types of conductive elements may be simultaneously embedded to different depths in a single substrate and from either or both sides thereof to form a variety of substrate structures.

Via and pad structure for thermoplastic substrates and method and

A polymeric article having isotropic properties is fabricated from anisotropic materials by orienting the polymer, as well as any fillers, in different directions at different planes through the polymeric article. In a first embodiment, molten polymer is passed between movable gate members (32 and 34) into cavity (30) of mold (28). The movable gate members (32 and 34) impart a strain on the molten polymer by moving in opposite directions (33 and 35) while the molten polymer is dispensed into the cavity (30). Reciprocating the movable gate members (32 and 34) yields a herringbone pattern. Having at least one movable gate member (38) have comb-like projections (40) can assure the strain is imparted deeper into the thickness of the polymeric article. In a second embodiment, molten polymer is passed through movable gates (96 and 100) on perpendicular sides of a mold cavity (94 and 98) where one movable gate (96) is located towards the top of the mold (84) and the other movable gate (100) is located towards the bottom of the mold (84). The gates (94 and 98) are simultaneously driven in directions (68 and 70) along their respective cavity sides while injecting polymer into the cavity. The finished article has a top layer (56) has polymer oriented (58) in a first direction and a bottom layer (52) with polymer oriented (54) in a perpendicular direction. Polymer is randomly oriented (62) between the top and bottom layer (56 and 52).

Dynamic gating of polymers for isotropic properties

Two movable die members that are situated opposed to each other in an extrusion die assembly, the axis of movement of the two die members is parallel to the longer sides of the rectangular cross-section of a throat opening of the extrusion die assembly. The members move in a reciprocating back and forward movement to impart shearing forces to the surface of the extruded material with a resultant multiaxial orientation of the molecules or fibrils.

Method and product for extruding materials that exhibit anisotropic

Extrusion method and apparatus in which the liquid precursor of the extruded material is forced through a die formed by two surfaces moving in opposite directions relative to one another and transversely to the direction of material flow. Immediately upon exiting this dynamic die, the extracted material is removed as a sheet or film through a take-off system. In a preferred embodiment of the invention, the first die is formed by members rotating on a common axis in opposite rotational directions.

Apparatus for extruding materials that exhibit anisotropic properties

A high density array of pinless electrical, spring connectors are supported in an electrically insulative carrier. The carrier has an array of cavity nests for receiving the spring connectors, locking them into a stable position and functioning as an electrical coupler between corresponding electrical contact pads in stacked modules.

Array of pinless connectors and a carrier therefor

Apparatus for extruding materials that exhibit anisotropic properties by

A method is provided for forming one or more electrical conductors in a multilayer structure such as a computer component during a punching operation. A conducting sheet is placed in direct contact with a sheet of a deformable dielectric material. A punch is used to form a conducting slug from the sheet and to simultaneously transfer the slug into the dielectric material. During the transfer operation, a portion of the dielectric material is displaced so as to cause a mechanical interference between the slug and dielectric material.

Method of direct transferring of electrically conductive elements into a

A single step electrical/mechanical connection process utilizes an adhesive layer (3 or 26) that is patterned on a substrate (1 or 21) to mechanically connect adjacent substrates in a multilayered structure (28) or to connect a pin (2) assembly to a device (5). In a preferred embodiment, the adhesive layer (3 or 26) and substrate (1 or 21) are made from materials which will undergo transesterification under heat and pressure to create a very strong bond therebetween. The adhesive layer (3 or 26) is positioned around and does not cover the solder (4) in the pin connector assembly or the alignment holes (24) in the molding/sheet (21), thereby allowing bonding metallurgy to make positive electrical connections between pins (2) and pads (6) and adjacent spheres (22) in a multilayered structure (28).

Single step electrical/mechanical connection process for connecting I/O

There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system. A ball may contact conductive traces on two levels of the insulating body and thereby provide an electrical connection between conductive traces. A method of manufacture of the connector system includes the steps of heating the plastic body to an elevated temperature, and driving the small metal balls through or against a respective conductive trace and into the plastic body which thereby captivates it. The conductive traces may be solder plated. After a ball is seated in contact with a conductive trace, the solder plating may be reflowed.

Method of manufacturing a high density connector system

Method for forming a multilayer microelectronic wiring module

The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.

Method of forming dual height solder interconnections

A polymeric article having isotropic properties is fabricated from anisotropic materials by orienting the polymer, as well as any fillers, in different directions at different planes through the polymeric article. In a first embodiment, molten polymer is passed between movable gate members (32 and 34) into cavity (30) of mold (28). The movable gate members (32 and 34) impart a strain on the molten polymer by moving in opposite directions (33 and 35) while the molten polymer is dispensed into the cavity (30). Reciprocating the movable gate members (32 and 34) yields a herringbone pattern. Having at least one movable gate member (38) have comb-like projections (40) can assure the strain is imparted deeper into the thickness of the polymeric article. In a second embodiment, molten polymer is passed through movable gates (96 and 100) on perpendicular sides of a mold cavity (94 and 98) where one movable gate (96) is located towards the top of the mold (84) and the other movable gate (100) is located towards the bottom of the mold (84). The gates (94 and 98) are simultaneously driven in directions (68 and 70) along their respective cavity sides while injecting polymer into the cavity. The finished article has a top layer (56) has polymer oriented (58) in a first direction and a bottom layer (52) with polymer oriented (54) in a perpendicular direction. Polymer is randomnly oriented (62) between the top and bottom layer (56 and 52).

Growing community of inventors

Poughkeepsie, NY, United States of America

Arthur Bross