The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 1994

Filed:

Dec. 31, 1992
Applicant:
Inventors:

Arthur Bross, Poughkeepsie, NY (US);

James J Hedrick, Oakland, CA (US);

Robert D Johnson, Morgan Hill, CA (US);

Robert O Lussow, Hopewell Junction, NY (US);

James R Lyerla, Jr, San Jose, CA (US);

Donald E Myers, Poughkeepsie, NY (US);

Joseph D Peruffo, Pleasant Valley, NY (US);

Krishna G Sachdev, Hopewell Junction, NY (US);

Thomas J Walsh, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
228175 ;
Abstract

A single step electrical/mechanical connection process utilizes an adhesive layer (3 or 26) that is patterned on a substrate (1 or 21) to mechanically connect adjacent substrates in a multilayered structure (28) or to connect a pin (2) assembly to a device (5). In a preferred embodiment, the adhesive layer (3 or 26) and substrate (1 or 21) are made from materials which will undergo transesterification under heat and pressure to create a very strong bond therebetween. The adhesive layer (3 or 26) is positioned around and does not cover the solder (4) in the pin connector assembly or the alignment holes (24) in the molding/sheet (21), thereby allowing bonding metallurgy to make positive electrical connections between pins (2) and pads (6) and adjacent spheres (22) in a multilayered structure (28).


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