Raleigh, NC, United States of America

Arnold Reisman

This inventor holds 17 USPTO granted patents, primarily in Microelectronics Packaging. Top assignees: Mcnc, Microelectronics Center of North Carolina, Northern Telecom Limited. Active years: 1986-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Arnold Reisman. Retrieved from https://idiyas.com/inventor/arnold-reisman-5nnaiw8t

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.1

ph-index = 12

Forward Citations = 636(Granted Patents)


Company Filing History:


Years Active: 1986-2001

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Areas of Expertise:
Microstructural Surgical Instruments
Thermal Treatment
Semiconductor Structure
Cyclic Pressure Modulation
Chemical Vapor Deposition
Material Deposition
Ceramic Bonding
Photoresist Exposure
Wiring Interconnection
Electrical Mounting
Oxide Isolation Process
Metal-to-Metal Bonding
17 patents (USPTO):Explore Patents

Title: **Arnold Reisman: Innovator in Microelectronics and Glass Technologies**

Introduction

Arnold Reisman, an esteemed inventor based in Raleigh, NC, has made significant contributions to the fields of microelectronics and materials science. With a prolific portfolio of 17 patents, Reisman's work has advanced the efficiency and functionality of integrated circuit technologies.

Latest Patents

Two of Arnold Reisman's latest patents illustrate his innovative approach to technology. The first involves methods for raising the reflow temperature of glass alloys through thermal treatment in steam. This process focuses on creating a doped or undoped germanosilicate glass layer on a substrate, which is thermally treated to enhance its reflow temperature. The technology enables the formation of nonplanar layers that can be planarized to improve their properties. Furthermore, a thermal pretreatment step may involve noble gas and nitrogen gas, essential for leveling the glass structure prior to treatment.

The second notable patent describes a high-performance integrated circuit chip package. This invention details a support substrate containing conductors and a multilayer wiring substrate that connects mounted chips. Notably, it includes a heat sink embedded with microchannels, enabling effective thermal management. The integration of a low melting point solder, specifically pure indium, allows the system to handle thermal stresses effectively, ensuring high performance and reliability.

Career Highlights

Arnold Reisman has historically collaborated with renowned institutions like the Microelectronics Center of North Carolina (MCNC), contributing his expert knowledge to various projects. His drive for innovation has consistently led to the development of advanced technologies that enhance integrated circuit applications.

Collaborations

Throughout his career, Reisman has worked alongside esteemed professionals such as Iwona Turlik and Carlton M. Osburn. These collaborations have enabled him to exchange ideas and drive forward innovative projects that have yielded significant technological breakthroughs.

Conclusion

With a remarkable array of patents and a solid professional background, Arnold Reisman continues to be a pivotal figure in the realm of microelectronics and material science. His inventions not only advance technological capabilities but also pave the way for future innovations in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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