IDiyas

For the Inventor, By the Inventor

Boise, ID, United States of America

Anurag Jindal

LinkedIn
USPTO Granted Patents = 19 

 

Average Co-Inventor Count = 3.8

ph-index = 3

Forward Citations = 26(Granted Patents)


Location History:

  • Singapore, SG (2017 - 2019)
  • Boise, ID (US) (2013 - 2021)

Company Filing History:

goldMedal16 out of 37,905 
 
Micron Technology Incorporated
 patents
silverMedal3 out of 2,305 
 
Nan Ya Technology Corporation
 patents

Years Active: 2013-2025

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19 patents (USPTO):Explore Patents
1. 12237217 - Methods of exposing conductive Vias of semiconductor devices and related semiconductor devices (2025-02-25),
2. 11011420 - Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods (2021-05-18),
3. 10847442 - Interconnect assemblies with through-silicon vias and stress-relief features (2020-11-24),
4. 10546777 - Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods (2020-01-28),
5. 10475810 - Conductive components and memory assemblies (2019-11-12),
6. 10014319 - Conductive components and memory assemblies (2018-07-03),
7. 9922875 - Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods (2018-03-20),
8. 9773807 - Conductive components and memory assemblies (2017-09-26),
9. 9754825 - Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods (2017-09-05),
10. 9627295 - Devices, systems and methods for manufacturing through-substrate vias and front-side structures (2017-04-18),
11. 9330975 - Integrated circuit substrates comprising through-substrate vias and methods of forming through-substrate vias (2016-05-03),
12. 9305865 - Devices, systems and methods for manufacturing through-substrate vias and front-side structures (2016-04-05),
13. 9099442 - Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods (2015-08-04),
14. 9034752 - Methods of exposing conductive vias of semiconductor devices and associated structures (2015-05-19),
15. 8956974 - Devices, systems, and methods related to planarizing semiconductor devices after forming openings (2015-02-17),

Title: Anurag Jindal: Innovator in Semiconductor Technology

Introduction: Anurag Jindal, based in Boise, ID, is a prominent inventor in the field of semiconductor devices. With a remarkable portfolio comprising 19 patents, Jindal has made significant contributions to innovations that enhance the performance and functionality of semiconductor technology.

Latest Patents: Among Jindal's latest patents are groundbreaking methods for exposing conductive vias in semiconductor devices. These methods involve positioning a barrier material over conductive vias that extend from a backside surface of a substrate, ensuring substantial conformity with the conductive vias. A self-planarizing isolation material is strategically placed to maintain a smooth surface, allowing for precise exposure of the conductive vias. Additionally, Jindal's patents describe semiconductor devices utilizing interconnect structures that incorporate negative thermal expansion (NTE) materials, which are crucial in accommodating thermal fluctuations in devices. In one embodiment, these devices feature a substrate with an opening that combines conductive materials with positive coefficients of thermal expansion, along with NTE materials, thereby enhancing durability and performance.

Career Highlights: Anurag Jindal has built a distinguished career, having worked with industry leaders such as Micron Technology Incorporated and Nan Ya Technology Corporation. His extensive experience in these companies has provided him with a profound understanding of semiconductor design and development, allowing him to spearhead innovative projects that push technological boundaries.

Collaborations: Throughout his career, Jindal has collaborated with notable colleagues, including Hongqi Li and Jin Lu. These partnerships have fostered an environment of shared knowledge and expertise, contributing to the advancement of semiconductor technologies.

Conclusion: Anurag Jindal's contributions to the semiconductor field through his 19 patents showcase his dedication to innovation and excellence. His work not only enhances the capabilities of semiconductor devices but also aligns with the ever-evolving demands of modern technology. Jindal's journey in invention serves as an inspiring example for aspiring inventors in the technology sector.

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