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Boise, ID, United States of America

Anurag Jindal

Average Co-Inventor Count = 3.80

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 26

Anurag JindalHongqi Li (12 patents)Anurag JindalJin Lu (7 patents)Anurag JindalShyam Ramalingam (6 patents)Anurag JindalJohn Mark Meldrim (3 patents)Anurag JindalDavid Ross Economy (3 patents)Anurag JindalKeen Wah Chow (3 patents)Anurag JindalDevesh Kumar Datta (3 patents)Anurag JindalSudip Bandyopadhyay (3 patents)Anurag JindalGowri Damarla (3 patents)Anurag JindalKyle K Kirby (2 patents)Anurag JindalIrina V Vasilyeva (2 patents)Anurag JindalBrett W Busch (2 patents)Anurag JindalThy Tran (2 patents)Anurag JindalJian He (2 patents)Anurag JindalLalapet Rangan Vasudevan (2 patents)Anurag JindalChia-Yen Ho (2 patents)Anurag JindalRoger W Lindsay (1 patent)Anurag JindalEric Blomiley (1 patent)Anurag JindalWayne H Huang (1 patent)Anurag JindalGowrisankar Damarla (1 patent)Anurag JindalAnurag Jindal (19 patents)Hongqi LiHongqi Li (32 patents)Jin LuJin Lu (21 patents)Shyam RamalingamShyam Ramalingam (11 patents)John Mark MeldrimJohn Mark Meldrim (66 patents)David Ross EconomyDavid Ross Economy (24 patents)Keen Wah ChowKeen Wah Chow (6 patents)Devesh Kumar DattaDevesh Kumar Datta (5 patents)Sudip BandyopadhyaySudip Bandyopadhyay (3 patents)Gowri DamarlaGowri Damarla (3 patents)Kyle K KirbyKyle K Kirby (210 patents)Irina V VasilyevaIrina V Vasilyeva (28 patents)Brett W BuschBrett W Busch (21 patents)Thy TranThy Tran (5 patents)Jian HeJian He (2 patents)Lalapet Rangan VasudevanLalapet Rangan Vasudevan (2 patents)Chia-Yen HoChia-Yen Ho (2 patents)Roger W LindsayRoger W Lindsay (62 patents)Eric BlomileyEric Blomiley (27 patents)Wayne H HuangWayne H Huang (24 patents)Gowrisankar DamarlaGowrisankar Damarla (12 patents)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Micron Technology Incorporated (16 from 37,905 patents)

2. Nan Ya Technology Corporation (3 from 2,305 patents)


19 patents:

1. 12237217 - Methods of exposing conductive Vias of semiconductor devices and related semiconductor devices

2. 11011420 - Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

3. 10847442 - Interconnect assemblies with through-silicon vias and stress-relief features

4. 10546777 - Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

5. 10475810 - Conductive components and memory assemblies

6. 10014319 - Conductive components and memory assemblies

7. 9922875 - Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

8. 9773807 - Conductive components and memory assemblies

9. 9754825 - Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

10. 9627295 - Devices, systems and methods for manufacturing through-substrate vias and front-side structures

11. 9330975 - Integrated circuit substrates comprising through-substrate vias and methods of forming through-substrate vias

12. 9305865 - Devices, systems and methods for manufacturing through-substrate vias and front-side structures

13. 9099442 - Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

14. 9034752 - Methods of exposing conductive vias of semiconductor devices and associated structures

15. 8956974 - Devices, systems, and methods related to planarizing semiconductor devices after forming openings

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12/6/2025
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