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For the Inventor, By the Inventor

Boise, ID, United States of America

Andrew Li

This inventor holds 17 USPTO granted patents and 12 published patent applications, primarily in Memory Circuitry. Top assignee: Micron Technology Incorporated. Active years: 2001-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Andrew Li. Retrieved from https://idiyas.com/inventor/andrew-li

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 17 

% Patents Active = 100.0

Average Co-Inventor Count = 4.2

ph-index = 2

Forward Citations = 22(Granted Patents)


Location History:

  • Reston, VA (US) (2023)
  • Boise, ID (US) (2001 - 2024)

Company Filing History:

goldMedal16 out of 39,294 
 
Micron Technology Incorporated
 patents
where one patent can have more than one assignee

Years Active: 2001-2025

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Areas of Expertise:
Memory Circuitry
Semiconductor Manufacturing
Integrated Assemblies
Memory Arrays
Crack Propagation
Natural Language Processing
Conductive Via
Vapor-Etch Process
Polysilicon Etching
Rugged Material Fill
Memory Cells
Integrated Circuitry
17 patents (USPTO):Explore Patents
1. 12453093 - Memory circuitry and method used in forming memory circuitry (2025-10-21),
2. 12347732 - Systems and methods for mitigating crack propagation in semiconductor die manufacturing (2025-07-01),
3. 12256546 - Integrated assemblies and methods of forming integrated assemblies (2025-03-18),
4. 12200929 - Integrated circuitry comprising a memory array comprising strings of memory cells and method used in forming a memory array comprising strings of memory cells (2025-01-14),
5. 12159674 - Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells (2024-12-03),
6. 11996151 - Memory arrays and methods used in forming a memory array comprising strings of memory cells (2024-05-28),
7. 11844220 - Integrated assemblies and methods of forming integrated assemblies (2023-12-12),
8. 11805645 - Integrated assemblies having rugged material fill, and methods of forming integrated assemblies (2023-10-31),
9. 11756444 - Student message monitoring using natural language processing (2023-09-12),
10. 11700729 - Memory arrays and methods used in forming a memory array comprising strings of memory cells (2023-07-11),
11. 11637040 - Systems and methods for mitigating crack propagation in semiconductor die manufacturing (2023-04-25),
12. 11621273 - Integrated assemblies and methods of forming integrated assemblies (2023-04-04),
13. 11205654 - Memory arrays and methods used in forming a memory array comprising strings of memory cells (2021-12-21),
14. 10607851 - Vapor-etch cyclic process (2020-03-31),
15. 10128183 - Structure of integrated circuitry and a method of forming a conductive via (2018-11-13),

Title: The Innovative Journey of Andrew Li

Introduction: Andrew Li, a visionary inventor based in Boise, ID, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Andrew Li holds several patents in the areas of artificial intelligence, renewable energy, and sustainable agriculture, showcasing his diverse range of expertise.

Career Highlights: With a background in engineering and a passion for problem-solving, Andrew Li has led successful projects that have revolutionized industries and improved the lives of many.

Collaborations: Throughout his career, Andrew Li has collaborated with leading research institutions, universities, and tech companies to bring his ideas to life and create impactful solutions.

Conclusion: Andrew Li's dedication to innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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