Tomerdingen, Germany

Andreas Tillmann


Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2006

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Andreas Tillmann

Introduction

Andreas Tillmann is a notable inventor based in Tomerdingen, Germany. He has made significant contributions to the field of thermal treatment of substrates, particularly in semiconductor technology. With a total of 2 patents, his work focuses on enhancing temperature control during thermal processing.

Latest Patents

Tillmann's latest patents include a method and apparatus for the thermal treatment of substrates. This invention aims to achieve a homogeneous temperature distribution in substrates, such as semiconductor wafers, during thermal treatment processes. The method involves altering the spatial arrangement of a temperature distribution influencing element within the process chamber. Additionally, he has developed a device for localized heating and cooling of semiconductor wafers. This apparatus allows for precise temperature control of specific regions of a wafer during heat cycles, utilizing gas nozzles and transparent gas pipes to achieve localized temperature adjustments.

Career Highlights

Throughout his career, Andreas Tillmann has worked with prominent companies in the semiconductor industry. He has been associated with Mattson Technology, Inc. and Steag RTP Systems GmbH, where he has contributed to advancements in thermal processing technologies.

Collaborations

Tillmann has collaborated with notable professionals in his field, including Sohaila Shooshtarian and Narasimha Acharya. Their combined expertise has likely contributed to the innovative developments in thermal treatment processes.

Conclusion

Andreas Tillmann's contributions to the field of thermal treatment of substrates demonstrate his commitment to innovation in semiconductor technology. His patents reflect a deep understanding of temperature control, which is crucial for the advancement of thermal processing techniques.

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