Aminuddin Ismail

Title: Innovations by Aminuddin Ismail

Introduction

Aminuddin Ismail is a notable inventor based in Selangor, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of integrated circuits and semiconductor packages.

Latest Patents

Aminuddin's latest patents include a heat spreader for center gate molding. This innovative heat spreader features a base portion that attaches to the surface of an integrated circuit, with at least one channel extending through it. The top portion is larger than the base, creating a generally T-shaped cross-section. This design allows mold compound to be injected through a central hole, facilitating effective heat dissipation.

Another significant patent is for a flip chip and wire bond semiconductor package. This invention includes a substrate with an opening, where contact pads are formed around the periphery. A flip chip die is mounted on one side, while a wire bond die is mounted through the opening, ensuring electrical communication with the contact pads. This design enhances the performance and reliability of semiconductor packages.

Career Highlights

Aminuddin Ismail is currently employed at Freescale Semiconductor, Inc., where he continues to innovate and develop new technologies. His expertise in semiconductor design has positioned him as a valuable asset to the company.

Collaborations

Aminuddin has collaborated with talented coworkers such as Chee Seng Foong and Wai Yew Lo. Their combined efforts contribute to the advancement of semiconductor technologies and innovations.

Conclusion

Aminuddin Ismail's contributions to the field of semiconductor technology through his patents demonstrate his commitment to innovation. His work not only enhances the efficiency of integrated circuits but also paves the way for future advancements in the industry.