The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2008
Filed:
Jan. 27, 2006
Aminuddin Ismail, Selangor Darul Ehsan, MY;
Chee Seng Foong, Selangor, MY;
Ruzaini Ibrahim, Selangor, MY;
Aminuddin Ismail, Selangor Darul Ehsan, MY;
Chee Seng Foong, Selangor, MY;
Ruzaini Ibrahim, Selangor, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method of packaging a semiconductor die () includes providing a flip-chip die () with bump connections () on its bottom surface (). An adhesive tape () is attached to a plate surface () and lead fingers () are formed on the tape (). The die () is placed on the tape () such that the bumps () on the die () contact respective ones of the lead fingers () on the tape (). A reflow process is performed on the die (), the tape () and the plate (), which forms C5 type interconnects. A mold compound () is formed over the die () and the tape (), and then the tape () and the plate () are removed.