Freescale Semiconductor,inc.

Aminuddin Ismail

Chee Seng Foong

Wai Yew Lo

Heng Keong Yip

Ruzaini B Ibrahim

Jin- Zhong Yao

Fu- Bin Song

Bee Hoon Liau

Jin- Mei Liu

Jian- Hong Wang

A heat spreader for an integrated circuit has a base portion and a top portion. The base portion is attachable to a surface of the integrated circuit, and has at least one channel extending therethrough. The top portion that is larger than the base portion such that the heat spreader is generally T-shaped in cross-section. The top portion has a hole at its center that extends from a top surface of the top portion to the at least one channel of the base portion. Mold compound is injected through the hole and out through the channels.

Heat spreader for center gate molding

A semiconductor package and method of forming the package, including a substrate having an opening formed therein. Contact pads are formed about a periphery of the opening on a first side of the substrate and a second opposing side of the substrate. A flip chip die is mounted to the substrate, having an active side mounted on a first side of the substrate and in electrical communication with at least some of the contact pads formed on the first side of the substrate. At least one wire bond die is mounted through the opening, with a non-active side mounted on the active side of the flip chip die. The wire bond die is in electrical communication with at least some of the plurality of contact pads formed on the second opposing side of the substrate.

Flip chip and wire bond semiconductor package

A method of packaging a semiconductor die () includes providing a flip-chip die () with bump connections () on its bottom surface (). An adhesive tape () is attached to a plate surface () and lead fingers () are formed on the tape (). The die () is placed on the tape () such that the bumps () on the die () contact respective ones of the lead fingers () on the tape (). A reflow process is performed on the die (), the tape () and the plate (), which forms C5 type interconnects. A mold compound () is formed over the die () and the tape (), and then the tape () and the plate () are removed.

Method of packaging semiconductor die without lead frame or substrate

Growing community of inventors

Selangor, Malaysia

Aminuddin Ismail