The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2009
Filed:
Oct. 31, 2005
Chee Seng Foong, Selangor, MY;
Aminuddin Ismail, Selangor, MY;
Wai Yew Lo, Selangor, MY;
Bee Hoon Liau, Selangor, MY;
Jin- Mei Liu, Tianjin, CN;
Jian- Hong Wang, Tianjin, CN;
Jin- Zhong Yao, Tianjin, CN;
Fu- Bin Song, Tianjin, CN;
Chee Seng Foong, Selangor, MY;
Aminuddin Ismail, Selangor, MY;
Wai Yew Lo, Selangor, MY;
Bee Hoon Liau, Selangor, MY;
Jin- Mei Liu, Tianjin, CN;
Jian- Hong Wang, Tianjin, CN;
Jin- Zhong Yao, Tianjin, CN;
Fu- Bin Song, Tianjin, CN;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A semiconductor package and method of forming the package, including a substrate having an opening formed therein. Contact pads are formed about a periphery of the opening on a first side of the substrate and a second opposing side of the substrate. A flip chip die is mounted to the substrate, having an active side mounted on a first side of the substrate and in electrical communication with at least some of the contact pads formed on the first side of the substrate. At least one wire bond die is mounted through the opening, with a non-active side mounted on the active side of the flip chip die. The wire bond die is in electrical communication with at least some of the plurality of contact pads formed on the second opposing side of the substrate.