This inventor holds 1 USPTO granted patent. Top assignee: Freescale Semiconductor,inc.. Active years: 2009.
Company Filing History:
Years Active: 2009
Title: Fu-Bin Song: Innovator in Semiconductor Packaging
Introduction
Fu-Bin Song is a notable inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods. His work has implications for the efficiency and functionality of electronic devices.
Latest Patents
Fu-Bin Song holds a patent for a "Flip chip and wire bond semiconductor package." This invention involves a semiconductor package and a method of forming the package, which includes a substrate with an opening formed therein. Contact pads are strategically placed around the periphery of the opening on both sides of the substrate. A flip chip die is mounted to the substrate, ensuring electrical communication with the contact pads. Additionally, a wire bond die is mounted through the opening, further enhancing the package's functionality.
Career Highlights
Fu-Bin Song is currently employed at Freescale Semiconductor, Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing packaging technologies that are crucial for modern electronics.
Collaborations
Some of his notable coworkers include Chee Seng Foong and Aminuddin Ismail, who contribute to the collaborative environment at Freescale Semiconductor, Inc. Their combined expertise fosters innovation and drives the development of cutting-edge technologies.
Conclusion
Fu-Bin Song's contributions to semiconductor packaging exemplify the importance of innovation in technology. His patent and work at Freescale Semiconductor, Inc. highlight his role as a key player in the advancement of electronic device efficiency.