Freescale Semiconductor,inc.

Fu- Bin Song

Chee Seng Foong

Wai Yew Lo

Aminuddin Ismail

Bee Hoon Liau

Jin- Mei Liu

Jian- Hong Wang

Jin- Zhong Yao

A semiconductor package and method of forming the package, including a substrate having an opening formed therein. Contact pads are formed about a periphery of the opening on a first side of the substrate and a second opposing side of the substrate. A flip chip die is mounted to the substrate, having an active side mounted on a first side of the substrate and in electrical communication with at least some of the contact pads formed on the first side of the substrate. At least one wire bond die is mounted through the opening, with a non-active side mounted on the active side of the flip chip die. The wire bond die is in electrical communication with at least some of the plurality of contact pads formed on the second opposing side of the substrate.

Flip chip and wire bond semiconductor package

Growing community of inventors

Tianjin, China

Fu- Bin Song