Jian- Hong Wang

Title: Innovations of Jian-Hong Wang in Semiconductor Packaging

Introduction

Jian-Hong Wang is a notable inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs and methods. His work has been recognized in the industry, showcasing his expertise and creativity.

Latest Patents

Jian-Hong Wang holds a patent for a "Flip chip and wire bond semiconductor package." This invention involves a semiconductor package and a method of forming the package, which includes a substrate with an opening formed therein. Contact pads are strategically placed around the periphery of the opening on both sides of the substrate. A flip chip die is mounted to the substrate, ensuring electrical communication with the contact pads. Additionally, a wire bond die is mounted through the opening, further enhancing the functionality of the semiconductor package.

Career Highlights

Wang is currently employed at Freescale Semiconductor, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has contributed to advancements in the efficiency and performance of semiconductor packages.

Collaborations

Throughout his career, Jian-Hong Wang has collaborated with talented professionals, including Chee Seng Foong and Aminuddin Ismail. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Jian-Hong Wang's contributions to semiconductor packaging exemplify the spirit of innovation in the technology sector. His patent and ongoing work at Freescale Semiconductor, Inc. highlight his commitment to advancing the field.